Kirin 990 5GOverview: Kirin 990 5G is the world’s first flagship 5G SoC with cutting-edge 7nm+ EUV manufacturing process. It is the first full-frequency 5G SoC, achieving leading 5G peak downlink rate. Kirin 990 5G is also the world’s first Da Vinci architecture NPU with all new Tiny-Core，fully leveraging the robust, intelligent computing power with ultra-low power consumption. With powerful CPU and 16-core Mali-G76 GPU, Kirin 990 5G facilitates a leap in performance and energy efficiency largely for consistently fast and smooth user experiences. With regard to photography, Kirin 990 5G equipped with ISP 5.0 that pioneers block-matching and 3D filtering (BM3D) and Dual-Domain video noise reduction, delivering sharp images and videos even in low light environments. Kirin 990 has also been significantly enhanced, delivering a next-level 4G mobile experience with upgraded performance, energy efficiency, AI and photography.. Main Specification: Process: 7nm+ EUV CPU: 2xA76-Based@2.86GHz + 2xA76-Based@2.36GHz + 4xA55@1.95GHz GPU: Mali-G76 MP16 Davinci Architecture，Ascend Lite*2+Ascend Tiny*1 Modem:2G/3G/4G/5G SA & NSA Fusion Network Architecture FDD & TDD Spectrum Access ISP 5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction Memory:LPDDR4X HiAI2.0 Architecture Highlights: As the world’s first flagship 5G SoC, Kirin 990 (5G) enables end users to access superb 5G connectivity, before the comprehensive rollout and commercialization of 5G has been achieved. In order to offer optimal 5G in all scenarios, Kirin 990 (5G) comes packed with cutting-edge performance, energy efficiency, AI computing and ISP, lifting the smartphone user experience to new heights. | Kirin 990Overview: Kirin 990 packs a dual-core NPU built on the Da Vinci architecture. The big core achieves excellent performance and energy efficiency in heavy computing scenarios, while the tiny core implements ultra-low power consumption, fully leveraging the robust, intelligent computing power brought out by the Da Vinci architecture. With the industry-leading 7nm manufacturing process, Kirin 990 achieves better performance and energy efficiency. In terms of CPU, Kirin 990 carries two big cores, two mid cores, and four little cores, with the dominant frequency of up to 2.86GHz. Kirin 990 utilizes the 16-core Mali-G76 GPU and system-level Smart Cache to implement intelligent traffic distribution, effectively saving bandwidth and reducing power consumption. To offer unrivaled smooth gaming, Kirin 990 supports Kirin Gaming+ 2.0, which enables efficient collaboration between hardware infrastructure and solutions. With regard to photography, Kirin 990 comes equipped with a brand-new ISP 5.0 that pioneers block-matching and 3D filtering (BM3D), professional-level hardware noise reduction (NR), and temporal and spatial NR (dual-domain NR) on videos, delivering sharp images and videos even in low light environments. Real-time video post-processing and rendering based on AI segmentation adjusts the image color frame-by-frame to provide cinematic viewing experiences. HiAI 2.0 has been upgraded to achieve the best-in-class framework and operator compatibility, with support for a maximum of 300+ operators. HiAI 2.0 is also compatible with all models under mainstream frameworks, equipping developers with more powerful and complete toolchains and spurring further AI application development. Main Specification: CPU: 2xA76-Based@2.86GHz + 2xA76-Based@2.09GHz + 4xA55@1.86GHz GPU: 16 core Mali-G76 Davinci Architecture，Ascend Lite*1+Ascend Tiny*1 ISP 5.0：BM3D DSLR-Level image noise reduction, Dual-Domain video noise reduction Memory: LPDDR4X HiAI 2.0 Architecture Modem:2G/3G/4G Highlights: Kirin 990 is designed to provide superior performance, optimal energy efficiency, and upgraded AI intelligence and photography capabilities for 4G mobile phone users. | Kirin 980Overview: The Kirin 980 is the world's first commercial mobile phone SoC chipset made with TSMC's 7 nm process, integrating 6.9 billion transistors to improve both performance and energy efficiency. It is the first of its kind developed based on ARM Cortex-A76, Mali-G76 GPU，a 1.4 Gbps high-speed Cat. 21 in the world. The Kirin 980 supports the world's fastest LPDDR4X with the rate up to 2133MHz, the world's fastest mobile phone Wi-Fi chipset, to support 160 MHz bandwidth. The theoretical peak download rate of this partnership is 1.7 Gbit/s. Main Specification: HiAI Architecture: CPU/GPU/NPU/ISP/DSP CPU: 2+2+4 flex-scheduling mechanism，2xA76 2.6GHz+ 2xA76 1.92Ghz + 4xA55 1.8Ghz GPU: Mali-G76 MP10 Dual NPU Coprocessor: i8 sensor coprocessor ISP: Huawei-developed ISP 4.0、multi-pass and multi-noise reduction technology、HDR color reproduction Memory:LPDDR4X @2133MHz Modem: DL 3CC+4*4MIMO+256 QAM，Cat.21，Download 1.4Gbps Security solutions: inSE；EMVCo Process: 7nm Highlights: The Kirin 980 is the fastest, highest performing, most energy efficient, and most intelligent chipset on the market. These outstanding features allow the chipset to provide more powerful, rich, and smart experiences to mobile users. |
Kirin 970Overview: Kirin 970 is built through the most advanced TSMC 10 nm process technology, which integrates 5.5 billion transistors in an area roughly the size of a fingernail. Kirin 970 combines an octa-core CPU, a 12-core GPU, dual ISP, a 1.2 Gbps high-speed Cat.18 LTE modem, and an innovative HiAI mobile computing architecture. Kirin 970 features ultra-fast connection, intelligent computing capability, HD audio-visual effects, and long battery life. Main Specification: HiAI Architecture: CPU/GPU/NPU/ISP/DSP CPU: 4x A73 +4x A53 GPU: Mali-G72 MP12 Dedicated NPU Coprocessor: i7 sensor coprocessor ISP: Dual ISP with face & motion detection, 4-Hybrid Focus Low-light & Motion Shooting Memory: LPDDR 4X Modem: LTE Cat18/13 1.2Gbps DL / 150 Mbps UL Voice solutions: Dual SIM, Dual VoLTE Audio: 32bit@384 KHz HD audio, AI noise reduction Video: 4K video, HDR 10 Security solutions: inSE 2.0 Process: 10nm Highlights: Kirin 970 is the first mobile AI computing platform of Huawei. With new HiAI mobile computing architecture which integrated a dedicated neural-network processing unit (NPU), Kirin 970 delivers about 25x the performance with 50x greater efficiency and greatly improves the capabilities in image recognition, voice interaction, and intelligent photography. | Kirin950Overview: Kirin 950 uses the industry-leading 16-nm FinFET plus process, new 4x A72+4x A53 big.LITTLE architecture and Mali T880 GPU to achieve a breakthrough in the high performance and long standby time. Main Specification: Specification: Kirin 950 Process: TSMC 16-nm FF+ CPU: 4x A72 2.3 GHz+4x A53 1.8 GHz GPU: Mali T880MP4 Memory: LPDDR4 LTE: Cat6 300 Mbit/s or 50 Mbit/s Coprocessor: i5 sensing coprocessor ISP: Dual 14-bit dual ISP 960 Mp/s with standalone DSP Audio: Hi-Fi audio DSP Video: 4K video decoder@H.265 Voice solutions: VoLTE Highlights: With the cutting-edge process, new architecture, leading-edge processing capability, and low power consumption features, the Kirin 950 processor has higher performance than the previous generations, and can better control the power consumption. | Kirin 960Overview: Kirin 960 introduces the brand-new 4x A73+4x A53 big.LITTLE architecture and Mali G71 graphics processor unit (GPU), and is the first to support the 4CC 600 Mbit/s rate. It realizes communications on all network systems, improves the performance, and prolongs the standby time. In addition, Kirin 960 integrates an embedded security engine inSE, realizing the finance-level security. Main Specification: Central processing unit (CPU): 4x A73 2.4 GHz+4x A53 1.8 GHz GPU: Mali G71MP8 Memory: LPDDR4 LTE: Cat12/13 600 Mbit/s or 150 Mbit/s Coprocessor: i6 sensing coprocessor Image signal processor (ISP): Improved dual 14-bit ISP 1000 Mp/s with standalone digital signal processor (DSP) Audio: Hi6403 Video: 4K video decoder@H.265 Voice solutions: Yueyin 2.0 (including HD voice+, Voice over LTE (VoLTE), and Voice over Wi-Fi (VoWIFI) Security solutions: inSE 1.0 Highlights: Kirin 960 implements upgrade from aspects such as performance, endurance, photographing, audio, communication, and security and reliability. It has better performance and efficiency than the previous-generation chip, integrates an embedded security engine inSE to make it the world's first SoC chip with the finance-level security. |
Kirin910Overview: As the first generation of the Kirin solutions, Kirin 910 features the 28-nm HPM packaging process, quad-core Cortex-A9 architecture, and Mali-450 GPU. It supports the LTE 4G network so that users can have longer standby time while enjoying the fast and smooth user experience. Main Specification: Process: 28-nm HPM CPU: 4x A9 1.6 GHz GPU: Mali-450 MP4 533 MHz Memory: LPDDR3 800 MHz LTE: LTE Cat4 150 Mbit/s or 50 Mbit/s Photographing: 16 megapixels Video: 1080p 30 fps video codec Voice solutions: SGLTE/CSFB/VoLTE/SRVCC Device handsets: Huawei P7/Huawei P6S Highlights: As the first Kirin solution, Kirin 910 implements the perfect balance between the performance and the power consumption. | Kirin920Overview: With the industry-leading octa-core big.LITTLE architecture, Kirin 920 is the first chip to be commercially used in the long-term evolution (LTE) Cat6 mobile phone. It attains a peak download rate of 300 Mbit/s, and boasts the state-of-art performance, manufacturing process, energy efficiency, and communication capability. Main Specification: Specification: Kirin 920 Process: 28-nm HPM CPU: 4x A15 1.7 GHz+4x A7 1.3 GHz GPU: Mali-T624 MP4 600 MHz Memory: 32-bit single-channel LPDDR3-1600 LTE: Cat6 300 Mbit/s or 50 Mbit/s Video: 1080p 60 fps video codec Highlights: With the global best octa-core architecture and the world's fastest 300 Mbit/s connectivity, Kirin 920 is the all-around champion of the 4G era. | Kirin930Overview: With the industry-leading octa-core big.LITTLE architecture, Kirin 930 can implement the intelligent scheduling according to different scenarios such as games, videos, and social activities to balance the performance and power consumption. Main Specification: Process: 28-nm HPC CPU: 4x A53 2.2–1.9 GHz+4x A53 1.5 GHz GPU: Mali 628MP4 680 MHz Memory: 2x LPDDR3 800 MHz LTE: Cat6 300 Mbit/s or 50 Mbit/s Coprocessor: i3 sensing coprocessor Display: WQXGA (2560 x 1600) Photographing: 20 megapixels Decoding & Encoding: 1080p 60 fps/H.264 Evolved high speed packet access (HSPA+): Cat24 42 Mbit/s or Cat6 5.76 Mbit/s Tabular data stream (TDS): R7 2.8 Mbit/s or 2.2 Mbit/s Global system for mobile communications (GSM): R6 Class33 Voice solutions: VoLTE/eSRVCC, CSFB, SGLTE, and DSDA Highlights: The Kirin 930 processor uses the industry-leading octa-core big.LITTLE architecture and i3 motion coprocessor, and supports security performance 2.0 and HiSEE security solutions to improve user data security while bring the strong performance and ultra-long standby time for mobile phone users. |
Kirin 810Overview: The first use of the NPU based on Huawei's in-house Da Vinci architecture enables Kirin 810 to achieve excellent AI energy efficiency and offer a wider range of on-device AI applications. Kirin 810 is a state-of-the-art 7 nm SoC. Compared with the 8 nm SoCs, the use of the 7 nm process technology improves energy efficiency by 20% and transistor density by 50%. As for the CPU, Kirin 810 offers outstanding processing performance thanks to the system-level AI frequency modulation scheduling technology and innovative 2+6 core architecture, namely two powerful Cortex-A76-based cores and six energy-efficient Cortex-A55 cores. The GPU is upgraded to the custom Mali-G52 that is capable of Kirin Gaming+, allowing for a much smoother gaming experience. In terms of photography, Kirin 810 integrates the detail enhancement (DE) module to support the latest auto white balance (AWB) algorithm and computing acceleration for the AR feature point cloud, improving the ISP performance and algorithm capability, greatly reducing noise, and enhancing details. Similar to Huawei's flagship SoCs, Kirin 810 offers the excellent communications capability. It supports dual-SIM dual-VoLTE, and provides stable, high-speed mobile communications in complex scenarios. In addition, by leveraging the in-house intermediate operator format, Kirin 810 greatly enhances its compatibility with Huawei HiAI, which accelerates the rollout of more AI applications. Main Specification: Process: 7nm CPU: 2×A76 2.27GHz+6×A55 1.88GHz GPU: Mali G52 NPU：Ascend D100 Lite Modem: LTE Cat.12/13 UL Dual SIM Dual VoLTE ISP: Kirin ISP4.0 Memory: LPDDR4X@2133MHz Highlights: Kirin 810 is powered by the brand-new AI SoC . As the first AI SoC built on Huawei's in-house Da Vinci architecture, Kirin 810 represents a step up in performance, AI energy efficiency, photography, and communications, delivering more amazing AI experiences for end users.. | ||
Kirin620Overview: As Huawei's first octa-core processor, Kirin 620 not only has the octa-core Cortex-A53 architecture design which focuses on the balance between the power consumption and the performance, Mali-450 MP4, LPDDDR3 memory, and also supports the maximum 150 Mbit/s LTE Cat.4. The performance, endurance, function, and network connectivity of Kirin 620 are all impeccable. Main Specification: Process: 28-nm HPM CPU: 8x A53 1.2 GHz GPU: Mali-450 MP4 500 MHz Memory: LPDDR3@ 800 MHz LTE: Cat4 Photographing: 13 megapixels Video Encoding & Decoding: 1080p 30 fps H.264 Highlights: The efficient and powerful Kirin 620 provides more fun experience with less power consumption. | Kirin650Overview: As the world's second piece of SoC produced massively with the 16-nm FinFET plus process, Kirin 650 boasts the new 4x A53+4x A53 big.LITTLE architecture and Mali T830 GPU to provide best user experience with high performance and low power consumption. Main Specification: Process: TSMC 16-nm FF+ CPU: 4x A53 2.0 GHz+4x A53 1.7 GHz GPU: Mali-T830 900 MHz Memory: LPDDR3 933 MHz LTE: LTE Cat7 Display: FHD Photographing: 16 megapixels, supporting the 8 megapixels+8 megapixels Video encoding: 1080p@30 fps Video decoding: 1080p@60 fps H.264 Highlights: The elaborated Huawei Kirin 650 chip aims to bring the flagship-level functions and experience for the medium- and high-end smartphones and tablets. | Kirin 710Overview: Kirin 710 offers high performance and great power efficiency, brings smoother running and greater gaming experience. It supports AI-powered scene recognition for photography, making it easy to get great photos. Kirin 710 supports dual SIM dual VoLTE for stable high-speed connections, coupled with TEE and inSE technologies, provide reliable security protection for mobile users. Main Specification: Process: 12nm CPU: 4×A73 2.2GHz+4×A53 1.7GHz GPU: Mali G51 Modem: LTE Cat.12/13 600Mbps DL/150Mbps UL Dual SIM Dual VoLTE ISP: AI-powered scene recognition, night scene shooting Security solutions: inSE & TEE Highlights: Kirin 710 can provides smartphone users with ultra-responsive experience with super computing power. |
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